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目錄 1. 產(chǎn)品樹形圖.............................................................................................................................................5 2. 射頻和微波器件特性圖............................................................................................................................7 2.1 預(yù)分頻器........................................................................................................................................................ 7 2.2 3 V 寬帶放大器.............................................................................................................................................. 8 2.3 5 V 寬帶放大器.............................................................................................................................................. 9 2.4 開關(guān)............................................................................................................................................................. 10 2.5 適用1.5 GHz/2.4 GHz/5.8 GHz 用途的低噪聲放大器(LNA)器件.................................................................. 12 2.6 硅LD MOS FET/SiGe HBT.......................................................................................................................... 14 2.7 NE55x 硅LD MOS FET ............................................................................................................................... 14 3. 產(chǎn)品列表...............................................................................................................................................15 3.1 IC................................................................................................................................................................. 15 3.1.1 AGC 放大器.................................................................................................................................... 15 3.1.2 下變頻器......................................................................................................................................... 16 3.1.3 預(yù)分頻器......................................................................................................................................... 16 3.1.4 開關(guān)................................................................................................................................................ 17 3.1.5 矩陣開關(guān)......................................................................................................................................... 20 3.1.6 上變頻器......................................................................................................................................... 20 3.1.7 寬帶放大器..................................................................................................................................... 21 3.1.8 功率放大器..................................................................................................................................... 22 3.1.9 低噪聲放大器 (LNA)......................................................................................................................... 23 3.1.10 低噪聲放大器 (低頻使用) ................................................................................................................. 23 3.2 分立器件...................................................................................................................................................... 24 3.2.1 低噪聲雙結(jié)晶體管............................................................................................................................ 24 3.2.2 SiGe HBT ....................................................................................................................................... 26 3.2.3 雙晶體管......................................................................................................................................... 27 3.2.4 低噪聲GaAs FET，HBT，HJ-FET ................................................................................................. 28 3.2.5 功率晶體管/FET.............................................................................................................................. 29 3.2.6 低噪聲MOS FET (低頻使用) ........................................................................................................... 30 3.3 MCM............................................................................................................................................................ 31 3.3.1 推挽式放大器.................................................................................................................................. 31 3.3.2 功率倍增放大器............................................................................................................................... 31 4. 封裝尺寸圖...........................................................................................................................................32 5. 封裝，特性對照表 (分立產(chǎn)品) ...............................................................................................................42 5.1 硅雙結(jié)晶體管，SiGe HBT ........................................................................................................................... 42 5.2 雙晶體管...................................................................................................................................................... 44 5.3 功率晶體管 (用于移動和便攜式無線電臺)..................................................................................................... 45 6. 標(biāo)記/器件編號.......................................................................................................................................46 6.1 小型封裝高頻IC 上的IC 標(biāo)記與器件編號..................................................................................................... 46 6.2 分立器件等級、標(biāo)記和規(guī)格列表 (包括：小型模、S01、75、79A、84C 封裝產(chǎn)品) ..................................... 48 資料下載： 
v02-Renesas-電子射頻和微波器件產(chǎn)品系列.pdf
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